Sep 24
Technical Specifications of Sony Cybershot DSC W570
Overview Camera type Compact Digital Camera
Battery (Type) Lithium ION
Dimensions Width (mm) 91
Depth (mm) 19
Height (mm) 52
Weight 100
Lens Focal Length(mm) 4.5 – 22.5mm (25 – 125mm)
f-number 2.6 – 6.3
Shutter Speed (seconds) iAuto (2 – 1/1,600) / Program Auto (1 – 1/1,600)
ISO rating Auto / 80 / 100 / 200 / 400 / 800 / 1600 / 3200
Interchangeability NA
Brand Carl Zeiss Vario-Tessar
Image Sensor Type CCD
Size(inches) 1/2.3
Total Resolution(MP) 16.40
Effective Resolution(MP) 16.10
Dust Reduction System NA
Viewfinder Type LCD
Size 2.7
Memory Card Type SD/SDHC Memory Card
Zoom Optical Zoom 5x
Digital Zoom 10x
Light Metering Multi Metering Yes
Center Weighted Metering Yes
Spot Metering Yes
Imaging Exposure Compensation Manual
Aperture Automatic
White Balance Automatic
Focus Automatic
Image Stabilization Automatic
Shooting Modes Yes
Built in Flash Automatic
Interface WiFi NA
Bluetooth NA
Picbridge NA
Hdmi NA
Primary Features Auto Bracketing NA
Self Timer 10.00
Face Detection Yes
Af Assist Lamp Yes
Movie Mode Yes
Red Eye Reduction Yes
Histogram NA
Colour Options Black, Gold, Purple, Pink
Warranty (Years) 1

Aug 23

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Apr 21

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Mar 24

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Feb 1

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Dec 5

BCC: Bump Chip Carrier
BGA: Ball Grid Array; BGA graphic
BQFP: Bumpered Quad Flat Pack
CABGA/SSBGA: Chip Array/Small Scale Ball Grid Array
CBGA: Ceramic Ball Grid Array
CFP: Ceramic Flat Pack
CPGA: Ceramic Pin Grid Array, CPGA Graphic
CQFP: Ceramic Quad Flat Pack, CQFP Graphic
TBD: Ceramic Lead-Less Chip Carrier
DFN: Dual Flat Pack, No Lead
DLCC: Dual Lead-Less Chip Carrier (Ceramic)
ETQFP: Extra Thin Quad Flat Package
FBGA: Fine-pitch Ball Grid Array
fpBGA: Fine Pitch Ball Grid Array
HSBGA: Heat Slug Ball Grid Array
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture
LBGA: Low-Profile Ball Grid Array
LCC: Leaded Chip Carrier LCC Graphic
LCC: Leaded Chip Carrier Un-formed LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array, LGA uP [Pins are on the Motherboard, not the socket]
LLCC: Leadless Leaded Chip Carrier LLCC Graphic
LQFP: Low Profile Quad Flat Package
MCMBGA: Multi Chip Module Ball Grid Array
MCMCABGA: Multi Chip Module-Chip Array Ball Grid Array
MLCC: Micro Lead-frame Chip Carrier
PBGA: Plastic Ball Grid Array
PLCC: Plastic Leaded Chip Carrier
PQFD: Plastic Quad Flat Pack
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package PSOP graphic
QFP: Quad Flatpack QFP Graphics
QSOP: Quarter Size Outline Package [Quarter Pitch Small Outline Package]
SBGA: Super BGA – above 500 Pin count
SOIC: Small Outline IC
SO Flat Pack: Small Outline Flat Pack IC
SOJ: Small-Outline Package [J-Lead]; J-Lead Picture
SOP: Small-Outline Package; SOP IC, Socket
SSOP: Shrink Small-Outline Package
TBGA: Thin Ball Grid Array
TQFP: Thin Quad Flat Pack TQFP Graphic
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVSOP: Thin Very Small-Outline Package
VQFB: Very-thin Quad Flat Pack


Nov 12

Here is the review of Intel® Core™ i7 Processor.

* 3.06 GHz, 2.93 GHz, and 2.66 GHz core speed
* 8 processing threads with Intel® HT technology
* 8 MB of Intel® Smart Cache
* 3 Channels of DDR3 1066 MHz memory